Memory corruption in video module... CVE-2022-25686

- AV AC AU C I A
发布： 2022-09-16
修订： 2024-11-21

Memory corruption in video module due to buffer overflow while processing WAV file in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

0%

漏洞利用/PoC

暂无可用Exp或PoC

受影响的平台与产品

当前有214条受影响产品信息